Business Development Manager-Power Electronics
申请 职位 ID 69e08317a54d801cae14e959 发布日期 06/03/2026Position Responsibilities
1.Being in charge of all business development activity in Power Electronics Packaging industry, fulfil the sales target according to company strategy;
2.Manage business alignment for customer accounts by identifying gaps in customer expectation and Heraeus’s offerings and working to reduce those gaps;
3.Develop a strong understanding of the customer’s expectation; recognize the business opportunities based on the customer roadmaps and shares these with the internal stakeholders;
4.Conduct adequate market research and search for potential supplier partners to lay a good foundation for possible future industry chain improvement
5.Collaborate with technical unit to prepare new business proposals for customers across segment;
6.Collect marketing information by frequent customer visiting, timely report to supervisor about the market trends, competitors’ information, relative industrial regulation updated etc.,
7.Support national & global R&D projects within response area,
8.Attend technical conferences to increase technical knowledge, understand industry trends, and build customer network;
9.Report account status to Heraeus management: financial, strategy, technical deliverables.
10.Establish a good long-term communication mechanism with direct customers, Tier1 and OEMs
11.Responsible for or support multinational or cross-department projects
12.Any other tasks from superior
Position Qualification & Requirements
1.Bachelor degree of Micro-Electronic, Electronic material or Semiconductor Engineering or related majors;
2.＞5 years Sales/BD experience in power semiconductor packaging material .
3.＞3 years engineering/R&D experience of power module industry.
4.＞2 years team leader or project management experience.
5.Familiar with power package (IPM/IGBT ) is preferred .
6.English skill, good in oral and written
7.Open communication; Time management; Quick learning; Working under pressure
8.Finance basic knowledge, Quality Management knowledge
9.Willingness to travel
10.Familiarize power devices packaging process and application of direct material .
11.Familiarize die top connection, Ag/Cu sinter/DBC/AMB application .
申请
1.Being in charge of all business development activity in Power Electronics Packaging industry, fulfil the sales target according to company strategy;
2.Manage business alignment for customer accounts by identifying gaps in customer expectation and Heraeus’s offerings and working to reduce those gaps;
3.Develop a strong understanding of the customer’s expectation; recognize the business opportunities based on the customer roadmaps and shares these with the internal stakeholders;
4.Conduct adequate market research and search for potential supplier partners to lay a good foundation for possible future industry chain improvement
5.Collaborate with technical unit to prepare new business proposals for customers across segment;
6.Collect marketing information by frequent customer visiting, timely report to supervisor about the market trends, competitors’ information, relative industrial regulation updated etc.,
7.Support national & global R&D projects within response area,
8.Attend technical conferences to increase technical knowledge, understand industry trends, and build customer network;
9.Report account status to Heraeus management: financial, strategy, technical deliverables.
10.Establish a good long-term communication mechanism with direct customers, Tier1 and OEMs
11.Responsible for or support multinational or cross-department projects
12.Any other tasks from superior
Position Qualification & Requirements
1.Bachelor degree of Micro-Electronic, Electronic material or Semiconductor Engineering or related majors;
2.＞5 years Sales/BD experience in power semiconductor packaging material .
3.＞3 years engineering/R&D experience of power module industry.
4.＞2 years team leader or project management experience.
5.Familiar with power package (IPM/IGBT ) is preferred .
6.English skill, good in oral and written
7.Open communication; Time management; Quick learning; Working under pressure
8.Finance basic knowledge, Quality Management knowledge
9.Willingness to travel
10.Familiarize power devices packaging process and application of direct material .
11.Familiarize die top connection, Ag/Cu sinter/DBC/AMB application .