Paste Development Engineer-Sinter
申请 职位 ID 69e08317a54d801cae14e95f 发布日期 06/03/2026Position Responsibilities
1.Development or Improvement of Formulation to fulfill spec 开发或优化产品配方以满足要求
2.Support successful product launches by generating the relevant application data 进行测试获取数据以支持公司新产品的开发
3.Learn and skillfully operate the equipment 熟练掌握相关仪器的使用方法，
4.Execute the application test as requested and prepare report执行应用测试实验计划, 出具结果报告
5.Act as the interface between R&D team and production/sales/customer. 成为研发团队与生产/销售/客户之间的沟通桥梁
6.Maintenance of equipment, including repair and vendor contact 相关的设备保管，维护，记录。负责和设备供应商的联络
7.Other tasks assigned by upper manager 其他由领导安排的技术性和行政类工作
Position Qualification & Requirements
1.Bachelor/Master’s degree in electronic packaging technology/Chemistry Engineering/ Material Science and Engineering / Mechanical Engineering; PhD is a plus化学工程/电子封装技术/材料科学与工程等相关专业的本科/硕士学历，博士优先
2.Bachelor with 5 years industrial experience. Master with min. 1 year industrial experience. 本科学历要求5年以上工作经验；硕士学历2年以上工作经验
3.Experience and knowledge on Ag or Cu Sinter process有银烧结或铜烧结相关的从业经验
4.Fluent oral English. Can read and write English.流利的英语沟通能力，要求基本的书面英语读写能力
5.Proficient in office software 熟悉办公室常用软件
6.Good hands-on experience required, 必须具有良好的动手能力
Good communication skill, verbal and emails良好的沟通能力
7.Familiar with rheology and organic chemistry. 熟悉流变学与有机化学
Hands-on experience on soldering and wire bonding is a big plus. 有仿真或AI技能者优先
申请
1.Development or Improvement of Formulation to fulfill spec 开发或优化产品配方以满足要求
2.Support successful product launches by generating the relevant application data 进行测试获取数据以支持公司新产品的开发
3.Learn and skillfully operate the equipment 熟练掌握相关仪器的使用方法，
4.Execute the application test as requested and prepare report执行应用测试实验计划, 出具结果报告
5.Act as the interface between R&D team and production/sales/customer. 成为研发团队与生产/销售/客户之间的沟通桥梁
6.Maintenance of equipment, including repair and vendor contact 相关的设备保管，维护，记录。负责和设备供应商的联络
7.Other tasks assigned by upper manager 其他由领导安排的技术性和行政类工作
Position Qualification & Requirements
1.Bachelor/Master’s degree in electronic packaging technology/Chemistry Engineering/ Material Science and Engineering / Mechanical Engineering; PhD is a plus化学工程/电子封装技术/材料科学与工程等相关专业的本科/硕士学历，博士优先
2.Bachelor with 5 years industrial experience. Master with min. 1 year industrial experience. 本科学历要求5年以上工作经验；硕士学历2年以上工作经验
3.Experience and knowledge on Ag or Cu Sinter process有银烧结或铜烧结相关的从业经验
4.Fluent oral English. Can read and write English.流利的英语沟通能力，要求基本的书面英语读写能力
5.Proficient in office software 熟悉办公室常用软件
6.Good hands-on experience required, 必须具有良好的动手能力
Good communication skill, verbal and emails良好的沟通能力
7.Familiar with rheology and organic chemistry. 熟悉流变学与有机化学
Hands-on experience on soldering and wire bonding is a big plus. 有仿真或AI技能者优先