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Paste Development Engineer

上海, 中国

申请
职位 ID TP00736 Functional area 研发创新 Full-time/part-time FULL_TIME Experience level N/A

Paste Development Engineer

As a Development Engineer, you will be at the forefront of technological innovation, driving the advancement of electronic packaging materials. You will have the opportunity to apply and expand your professional knowledge while enhancing your project management and communication skills through collaboration with cross-functional teams. Participating in international conferences and seminars will allow you to exchange ideas with global peers and stay updated on the latest industry trends and technological advancements. Additionally, you will have the chance to establish your professional reputation in the industry by publishing academic articles and applying for international patents, showcasing your innovative achievements.

Overall description
As a Development Engineer, you will be responsible for the development and optimization of new materials, focusing on solder paste and flux materials for electronic applications. You will apply your scientific and engineering thinking, along with your professional skills, to collaborate with functional departments and drive projects from concept to market globally.

Key Responsibilities:
  • Independently implement innovation projects.
  • Design, experiment, and optimize material formulations.
  • Analyze material performance to ensure products meet industry standards and customer needs.
  • Write detailed experimental reports and project documentation.
  • Collaborate with cross-functional teams, including production, quality control, and marketing.
  • Keep abreast of the latest material science research to support product innovation.
  • Participate in international conferences and seminars to exchange the latest developments with global peers.

Basic Requirements:
  • Master’s degree or higher in material science, chemical engineering, or a related field.
  • Good work attitude and passion for the innovation career in electronic packaging materials.
  • Strong scientific and engineering thinking abilities in a logical way.
  • Good English written and oral communication skills, capable of writing technical documents and engaging in international communication.
  • Good project management and organizational skills.
  • At least 1 years of experience with industry background, which can encompass professional work experience or substantial internship experience.
  • Ability to work independently and as a strong team player.
  • Holding international patents or having published articles in academic journals.

Preferred Qualifications:
  • Experience in solder paste development with industry background preferred.
  • Experience in multinational project collaboration.
  • A Ph.D. is preferred, especially in the field of electronic packaging materials.
  • Familiarity with the latest technologies and trends in the field of electronic packaging materials.
  • German language skills are a plus.
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